High solids, two-component silver epoxy. Easy, non-critical 1:1 mixing with a fast cure at low heat or room temperature. Exhibits outstanding adhesion to a variety of substrates including ceramic, glass, metal and plastic.

Applications: Printed circuit board repairs │ Electrical soldering replacement │ Chip bonding │ Die attachment │ Static discharge/grounding │ Thermal dissipation │ Usage as a general electrically conductive cement for heat sensitive components

Highly flexible, two-component silver epoxy. Easy, non-critical 1:1 mixing with a fast cure at low heat or room temperature. When properly cured, is highly conductive, exhibits outstanding adhesion, and is extremely crack-resistant - even when creased at 180°.

Applications: Making and/or repairing flexible circuitry │ Chip bonding │ Die attachment │ Solderless wire connectrions

Highly flexible, two-component silver epoxy. Easy, non-critical 1:1 mixing with a fast cure at low heat or room temperature. Can be used on surfaces exposed to wet/damp environments. Highly conductive,  outstanding adhesion, and extremely crack-resistant. Excellent shock-resistant properties when applied to rigid substrates.

Applications: Making/repairing flexible circuitry │ Chip bonding │ Die attachment │ Solderless wire connections │ Repair of automotive rear window defogger and antenna circuits

100% solids, two-component silver epoxy. Easy, non-critical 1:1 mixing with a fast cure at room temperature. Exhibits outstanding adhesion to a variety of substrates including ceramic, glass, metal, and plastic.

Applications: Printed circuit board repairs │ Electrical soldering replacement │ Chip bonding │ Die attachment │ Static discharge/grounding │ Rear window defroster attachment │ Usage as a general electrically conductive cement for heat sensitive components

High solids, one-component silver epoxy designed for screen printing. Material exhibits outstanding adhesion to a variety of substrates including ceramic, glass, metal, and plastic.

Applications: Printed circuit board repairs │ Electrical soldering replacement │ Chip bonding │ Die attachment │ Static discharge/grounding │ Windshield bus bars │ Usage as a general electrically conductive cement for heat sensitive components

100% solids, two-component silver epoxy designed for a quick cure at room temperature. Exhibits outstanding adhesion to a variety of substrates including ceramic, glass, metal, and plastic.

Applications: Printed circuit board repairs │ Electrical soldering replacement │ Chip bonding │ Die attachment │ Static discharge/grounding │ Rear window defroster attachment │ Usage as a general electrically conductive cement for heat sensitive components

One-component, ultra-clean silver filled polyimide adhesive. When properly cured, can exhibit outstanding resistance to most chemicals and solvents, is highly conductive, and can withstand brief excursions to 450°C. This high purity material also has extremely low ionic impurity levels.

Applications: Designed primarily for use in bonding quartz crystals