Screen printable, low temperature firing, gold conductor composition developed for use in chip and wire bonding applications and for use in making high performance, fine line circuitry on a variety of temperature sensitive substrates, including pyrex type glasses. The composition can be fired as low as 750°C and permits resolutions of 125 micron lines and spaces.

Applications: Usage in chip and wire bonding applications │ Usage in making high performance, fine line circuitry on a variety of temperature sensitive substrates - including pyrex type glasses 

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Ultra low firing, gold conductor composition designed for use in making high performance electrodes on a variety of glass, porcelain enamel, and ceramic substrates. The fired film, which is suitable for direct soldering, is highly conductive and exhibits outstanding adhesion to most glass-based surfaces. The composition can be fired as low as 490°C and permits resolution of 125 micron lines and spaces.

Applications: Applied via screen printing or through automatic dispensing equipment